RF741 is a high-viscosity No-Clean paste flux developed to assist in printed circuit board rework or repair. RF741 is an effective paste flux for prototype work where a small amount of flux is needed on a specific area of a board or assembly. After being dispensed, rework flux stays in pluntil soldering occurs. Exhibits excellent performance in applications requiring a flux having good thermal stability such as surfmount component or repair. It is the ideal choice for QFP or BGA rework operations. It is also well suited for use with through-hole repair operations. Residues that remain after soldering are almost colorless, leaving a cosmetically appealing repair. The residue has high electrical resistance is safe to be left on the assembly after soldering. Model # RF741 Features: High Viscosity- stays where you put it May be used with leaded or lead-free solders Residues are non-corrosive, no need to be removed after soldering Leaves bright/shiny solder joints after reflow Lead Free - RoHS compliant.
