Description:

Epoxy mold release apply to a surfbefore pouring in encapsulating and potting compound. It allows for a clean removal of the cured epoxy. For use with all types of epoxies and phenolic resins. RoHS compliant. Model # 8329-350G Features: Epoxy mold release Non-Silicone It allows for a clean removal of the cured epoxy For use with all types of epoxies and phenolic resins.